Transparent display with OLED substrate having multiple hollow parts and manufacturing method thereof

ABSTRACT

An OLED substrate is provided, which comprises a light emitting region and a transparent region, wherein the OLED substrate comprises a substrate and a display layer on the substrate, and a portion of the display layer located in the transparent region has a first hollow part. A method for manufacturing an OLED substrate and a transparent display comprising an OLED substrate are further provided.

RELATED APPLICATION

The present application claims the benefit of Chinese Patent ApplicationNo. 201811161433.X, filed on Sep. 30, 2018, the entire disclosure ofwhich is incorporated herein by reference.

FIELD

The present disclosure relates to the field of display technologies, andespecially to an OLED substrate, a method for manufacturing an OLEDsubstrate, and a transparent display.

BACKGROUND

With the rapid development of science and technology, a variety of noveltechnologies are emerging. Transparent displays among them have receivedmore and more attention due to their unique performance.

SUMMARY

An aspect of the present disclosure provides an OLED substratecomprising a light emitting region and a transparent region, wherein theOLED substrate comprises a substrate and a display layer on thesubstrate, and a portion of the display layer in the transparent regionhas a first hollow part.

According to some exemplary embodiments of the present disclosure, thesubstrate comprises a base substrate and a transparent etch barrierlayer between the base substrate and the display layer.

According to some exemplary embodiments of the present disclosure, thesubstrate comprises a base substrate and a light shielding layer betweenthe base substrate and the display layer, and wherein a portion of thelight shielding layer in the transparent region has a second hollowpart, an orthographic projection of the first hollow part on the basesubstrate at least partially overlaps an orthographic projection of thesecond hollow part on the base substrate.

According to some exemplary embodiments of the present disclosure, theorthographic projection of the first hollow part on the base substratecoincides with the orthographic projection of the second hollow part onthe base substrate.

According to some exemplary embodiments of the present disclosure, theorthographic projection of the second hollow part on the base substrateis within the orthographic projection of the first hollow part on thebase substrate.

According to some exemplary embodiments of the present disclosure, theabove OLED substrate further comprises a transparent etch barrier layerbetween the light shielding layer and the display layer.

According to some exemplary embodiments of the present disclosure, thelight shielding layer comprises one or more of a black resin layer and ametal layer.

According to some exemplary embodiments of the present disclosure, thelight shielding layer comprises a metal layer and the etch barrier layercomprises a transparent conductive layer.

According to some exemplary embodiments of the present disclosure, thedisplay layer comprises a buffer layer, a thin film transistor, aplanarization layer, a light emitting device, and a pixel defining layerin sequence on the substrate.

According to some exemplary embodiments of the present disclosure, theOLED substrate comprises a plurality of pixel units arranged in amatrix, each pixel unit of the plurality of pixel units comprises atleast one sub-pixel unit, each sub-pixel unit of the at least onesub-pixel unit comprises a light emitting sub-region and a transparentsub-region, all light emitting sub-regions constitute the light emittingregion, and all transparent sub-regions constitute the transparentregion.

According to some exemplary embodiments of the present disclosure, theOLED substrate comprises a plurality of pixel units arranged in amatrix, each pixel unit of the plurality of pixel units comprises atleast one sub-pixel unit, all sub-pixel units constitute the lightemitting region, and regions among the plurality of pixel unitsconstitute the transparent region.

According to some exemplary embodiments of the present disclosure, theabove OLED substrate further comprises wirings on the light shieldinglayer, wherein the wirings are formed of a same material in a same layeras at least one layer of the display layer.

Another aspect of the present disclosure provides a transparent displaycomprising any of the OLED substrates described above and a packagelayer on the OLED substrate.

According to some exemplary embodiments of the present disclosure, thepackage layer comprises one of a substrate package layer and a thin filmpackage layer.

A further aspect of the present disclosure provides a method formanufacturing an OLED substrate, the OLED substrate comprising a lightemitting region and a transparent region, the method comprising:providing a substrate; forming a display layer on the substrate; andforming a first hollow part in a portion of the display layer in thetransparent region.

According to some exemplary embodiments of the present disclosure, thefirst hollow part is formed by an etching process, and wherein saidproviding a substrate comprises: providing a base substrate; and forminga transparent etch barrier layer on the base substrate.

According to some exemplary embodiments of the present disclosure, saidproviding a substrate comprises: providing a base substrate; forming alight shielding layer on the base substrate; and forming a second hollowpart in a portion of the light shielding layer in the transparentregion, an orthographic projection of the first hollow part on the basesubstrate at least partially overlapping an orthographic projection ofthe second hollow part on the base substrate.

According to some exemplary embodiments of the present disclosure, theorthographic projection of the second hollow part on the base substrateis within the orthographic projection of the first hollow part on thebase substrate.

According to some exemplary embodiments of the present disclosure, saidforming a display layer on the substrate comprises: forming a bufferlayer, a thin film transistor, a planarization layer, a light emittingdevice, and a pixel defining layer on the substrate successively.

According to some exemplary embodiments of the present disclosure, theabove method further comprises forming wirings on the light shieldinglayer, wherein the wirings are formed simultaneously with at least onelayer of the display layer.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to illustrate the embodiments of the present disclosure or thetechnical solutions in related art more clearly, the drawings to be usedfor description of the embodiments or the related art will be brieflydescribed below. It is apparent that the drawings in the descriptionbelow are only some of the embodiments of the present disclosure, andother drawings may be further obtained by a person having an ordinaryskill in the art based on these drawings without spending inventiveefforts.

FIG. 1 is a schematic structural view of a transparent display providedby the related art;

FIG. 2 is a schematic structural view of one sub-pixel region of atransparent display comprising a light emitting region and a transparentregion provided by the related art;

FIG. 3 is a schematic structural view of an OLED substrate provided byan embodiment of the present disclosure;

FIG. 4 is a schematic structural view of an OLED substrate provided byan embodiment of the present disclosure;

FIG. 5 is a schematic structural view of an OLED substrate provided byan embodiment of the present disclosure;

FIG. 6 is a schematic structural view of an OLED substrate provided byan embodiment of the present disclosure;

FIG. 7 is a schematic structural view of an OLED substrate provided byan embodiment of the present disclosure;

FIG. 8 is a schematic structural view of an OLED substrate provided byan embodiment of the present disclosure;

FIG. 9 is a schematic structural view of an OLED substrate provided byan embodiment of the present disclosure;

FIG. 10 is a schematic structural view of an OLED substrate provided byan embodiment of the present disclosure;

FIG. 11 is a schematic structural view of an OLED substrate provided byan embodiment of the present disclosure;

FIG. 12 is a schematic structural view of an OLED substrate provided byan embodiment of the present disclosure;

FIG. 13 is a schematic structural view of a transparent display providedby an embodiment of the present disclosure; and

FIG. 14 is a schematic structural view of another transparent displayprovided by an embodiment of the present disclosure.

DETAILED DESCRIPTION

The technical solutions in embodiments of the present disclosure will beclearly and completely described below with reference to theaccompanying drawings. It is obvious that the described embodiments areonly a part of the embodiments of the present disclosure, rather thanall of them. All other embodiments obtained by a person having anordinary skill in the art based on the embodiments of the presentdisclosure without spending inventive efforts fall within the scope ofthe present disclosure.

Generally, a transparent display refers to a display which has a certaindegree of light penetrability. For example, as shown in FIG. 1, thetransparent display comprises both a light emitting region 01 and atransparent region 02. An important indicator for determining theperformance of a transparent display panel is the transmittance of thetransparent region 02, because its transmittance determines how muchlight can pass through the display panel, thereby affecting thebrightness of an image acquired through the transparent region 02.However, as shown in FIG. 1, since film layers in the transparentdisplay such as a gate insulating layer (GI) 202 and an interlayerdielectric layer (ILD) 206 in a thin film transistor (TFT) 20, aplanarization layer 30, a pixel defining layer 70, and the like have lowtransmittance, and light will be reflected and refracted when passingthrough these film layers, the light transmittance of the transparentdisplay is decreased, thereby degrading the user experience.

Specifically, in the related art, a transparent organic light emittingdisplay (OLED) comprises an OLED substrate comprising a light emittingregion and a transparent region. The transparent region in the OLEDsubstrate can be designed in the OLED substrate as needed. For example,as shown in FIG. 2, gate lines 90 and data lines 100 which intersectwith each other enclose a plurality of sub-pixel regions, and onesub-pixel region is divided into a light emitting region 01 and atransparent region 02. Alternatively, it is also possible to arrange atransparent region every other pixel region (one pixel region comprisesone or more sub-pixel regions, and the one or more sub-pixel region arethe light emitting region).

An embodiment of the present disclosure provides an OLED substrate thatcontributes to an improved transparent display effect. As shown in FIG.3, the OLED substrate comprises a light emitting region 01 and atransparent region 02. The OLED substrate comprises a substrate 110 anda display layer 120 located on the substrate 110, wherein a portion ofthe display layer 120 located in the transparent region 02 has a firsthollow part H.

It is to be noted that the substrate 110 refers to a structure under thedisplay layer that realizes the display function in the OLED substrate,which may comprise a base substrate only, and may also comprise a basesubstrate and other film layers located between the base substrate andthe display layer.

As used herein, a portion of the display layer 120 located in thetransparent region 02 has a first hollow part H, which may mean that theportion of the display layer 120 located in the transparent region 02 iscompletely hollowed out, that is, the portion of the display layer 120located in the transparent region 02 is completely removed, and may alsomean that the portion of the display layer 120 located in thetransparent region 02 is partially hollowed out, that is, the portion ofthe display layer 120 located in the transparent region 02 is partiallyremoved, while other portions are retained.

In the above-described OLED substrate provided by an embodiment of thepresent disclosure, since the portion of the display layer 120 locatedin the transparent region 02 has the first hollow part H, loss of lightcaused by the display layer 120 when the light passes through the firsthollow part H is avoided, so that the transmittance of light is enhancedwhen the light passes through the transparent region 02 of the OLEDsubstrate. In case the above-described OLED substrate is applied to anOLED transparent display, the light transmittance of the transparentdisplay is enhanced such that the brightness of an image acquiredthrough the transparent region is increased, thereby improving the userexperience.

Specifically, as shown in FIG. 4, the display layer 120 may include, butis not limited to, a thin film transistor 20, a light emitting device,and a pixel defining layer 70. The thin film transistor 20 comprises anactive layer 201, a gate insulating layer 202, a gate 203, an interlayerdielectric layer 206, a first terminal 205, and a second terminal 204.The second terminal 204 and the first terminal 205 are both connected tothe active layer. The pixel defining layer 70 has a plurality ofopenings such that the light emitting device is disposed in a respectiveone of the openings. The light emitting device comprises an anode 40, acathode 60, and a light emitting functional layer 50 sandwiched betweenthe anode 40 and the cathode 60. The second terminal 204 of the thinfilm transistor 20 is electrically connected to the anode 40 of thelight emitting device, thereby driving the light emitting device to emitlight. The light emitting functional layer 50 of the light emittingdevice comprises a light emitting layer, and optionally, at least one ofan electron transport layer, an electron injection layer, a holetransport layer, and a hole injection layer.

Further, as shown in FIG. 4, the display layer 120 may further comprisea planarization layer 30 which is disposed between the thin filmtransistor 20 and the light emitting device to provide a flat supportsurface for the light emitting device, to ensure uniformity of lightemitted from the light emitting device.

Further, as shown in FIG. 5, the display layer 120 may further comprisea buffer layer 130 disposed on the substrate 110, and the thin filmtransistor 20 and the light emitting device are disposed on the bufferlayer 130. The buffer layer 130 can play the role of adjusting stresses,neutralizing charges, and the like.

Upon implementation, the first hollow part H of the display layer 120may be formed by an etching process. The manufacturing process of thedisplay layer 120 will be described in detail below based on an examplein which the display layer 120 comprises the buffer layer 130, the thinfilm transistor 20, the planarization layer 30, and the light emittingdevice disposed on the substrate 110 successively.

As shown in FIG. 5, firstly, a buffer layer film is formed on thesubstrate 110 by, for example, a deposition process. Then, an activelayer film is formed on the buffer layer film, and the active layer filmis patterned to form an active layer 201. Next, a gate insulating layerfilm is formed on the active layer 201. A first conductive film isformed on the gate insulating layer film, and the first conductive filmis patterned to form a gate 203. An interlayer dielectric layer film isformed on the gate 203, and portions of the interlayer dielectric layerfilm and the gate insulating layer film located in the light emittingregion 01 are etched to form a first terminal contact hole and a secondterminal contact hole. The interlayer dielectric layer film, the gateinsulating layer film, and the buffer layer film located in thetransparent region 02 are etched (for example, dry-etched) to form aportion of the first hollow part in the interlayer dielectric layerfilm, the gate insulating layer film, and the buffer layer film, tothereby form an interlayer dielectric layer 206, a gate insulating layer202 and a buffer layer 130. Then, a second conductive film is formed onthe interlayer dielectric layer 206. The second conductive film fillsthe first terminal contact hole and the second terminal contact hole,and the second conductive film is patterned to form a first terminal 205and a second terminal 204. The first terminal 205 is connected to theactive layer 201 via the first terminal contact hole, and the secondterminal 204 is connected to the active layer 201 via the secondterminal contact hole.

Next, a planarization film is formed on the first terminal 205 and thesecond terminal 204, the planarization film is patterned to form a viahole that exposes at least a portion of the second terminal 204, and toform a portion of the first hollow part in the planarization film in thetransparent region 02, to form a planarization layer 30. A thirdconductive film is formed on the planarization layer 30, and the thirdconductive film is patterned to form an anode 40 which is electricallyconnected to the second terminal 204 through the via hole in theplanarization layer 30. Then, a pixel defining layer film is formed onthe anode 40, and the pixel defining layer film is patterned to form apixel defining layer 70 which has an opening in the light emittingregion 01 to expose the anode 40 of the light emitting device, and has ahollow part in the transparent region 02. A light emitting functionallayer 50 and a fourth conductive film are formed successively in theopening of the pixel defining layer 70, and the fourth conductive filmis patterned such that a portion of the fourth conductive film locatedin the transparent region 02 has a hollow part, and a cathode 60 of thelight emitting device is formed.

In the above manufacturing process, the patterning of the active layerfilm, the first conductive film, the second conductive film, the thirdconductive film, the fourth conductive film, the planarization film, andthe pixel defining layer film may include processes such as photoresistcoating, exposure, development, etching, photoresist removal, and thelike.

In the process of forming the display layer 120, an etching processneeds to be used to form the first hollow part. If the display layer 120is directly formed on the base substrate, when etching is beingperformed to form the display layer 120 comprising the first hollowpart, the base substrate is easily over-etched, resulting in surfaceunevenness of the base substrate. The uneven surface of the basesubstrate 10 would scatter light incident thereon, thereby affecting thedisplay effect of an OLED display.

On this basis, in an exemplary embodiment of the present disclosure, asshown in FIG. 6, the substrate 110 comprises a base substrate 10 and atransparent etch barrier layer 11 located between the base substrate 10and the display layer 120. The etch barrier layer 11 may be configuredto block etching, that is, during etching, when etching proceeds to theetch barrier layer 11, the etching process stops automatically.

The material of the etch barrier layer 11 is not limited as long as itis capable of blocking etching during the etching process. For example,the material of the etch barrier layer 11 may be ITO (Indium Tin Oxide)and/or IZO (Indium Zinc Oxide). Here, since the etch barrier layer 11 istransparent, it does not affect the transmission of light.

In the above embodiment, the substrate 110 comprises the base substrate10 and the etch barrier layer 11. Since the etch barrier layer 11 canblock etching during the process of etching the display layer 120, thesurface of the substrate 110 can be kept flat, thereby effectivelyavoiding light scattering.

In an exemplary embodiment, as shown in FIGS. 7 and 8, the substrate 110comprises a base substrate 10 and a light shielding layer 12 locatedbetween the base substrate 10 and the display layer 120. A portion ofthe light shielding layer 12 located in the transparent region 02 has asecond hollow part H′.

Here, the material of the light shielding layer 12 is not limited aslong as it is capable of shielding light. For example, the material ofthe light shielding layer 12 may be a black resin, a metal or the like.Since the thin film transistor 20 and the light emitting device need tobe subjected to high-temperature treatment during the manufacturingprocess, and the metal is generally high temperature-resistant,embodiments of the present disclosure may advantageously employ a metalmaterial as the material of the light shielding layer 12. However, incase the material of the light shielding layer 12 is a metal material,induced charges are easily generated on the light shielding layer 12,which may cause the voltage of the thin film transistor 20 to beunstable (floating). Therefore, in the case where the material of thelight shielding layer 12 is a metal material and the substrate 110comprises the etch barrier layer 11, the material of the etch barrierlayer 11 may be advantageously selected as a transparent conductivematerial. Since the etch barrier layer 11 has electrical conductivity,it is possible to connect the etch barrier layer 11 to the wirings onthe OLED substrate and apply a fixed voltage to the wirings, to ensurethat the light shielding layer 12 and the etch barrier layer 11 havestable voltages, which in turn avoids the phenomenon that the lightshielding layer 12 and the etch barrier layer 11 cause the voltage ofthe thin film transistor 20 to be unstable.

On this basis, when the material of the etch barrier layer 11 is atransparent conductive material, the material of the etch barrier layer11 may be selected from at least one of ITO or IZO.

Upon implementation, a light shielding film may be formed on the basesubstrate 10, and then the light shielding film is patterned to form thelight shielding layer 12.

In an exemplary embodiment, the orthographic projection of the firsthollow part H on the base substrate 10 at least partially overlaps thatof the second hollow part H′ on the base substrate 10. For example, theorthographic projection of the second hollow part on the base substrate10 coincides with that of the first hollow part on the base substrate10. Alternatively, the orthographic projection of the second hollow parton the base substrate 10 is located within that of the first hollow parton the base substrate 10. Alternatively, the orthographic projection ofthe first hollow part on the base substrate 10 is located within that ofthe second hollow part on the base substrate 10.

Inventors of the present disclosure have found that, when images arebeing acquired through the transparent region 02, an interferencephenomenon occurs when light is incident on the edge of the first hollowpart of the display layer 120, so that bright spots will appear in theimages acquired through the transparent region 02. Therefore,advantageously, as shown in FIG. 9, it is possible to make theorthographic projection of the second hollow part H′ on the basesubstrate 10 located within that of the first hollow part H on the basesubstrate 10. In this way, when images are being acquired through thetransparent region 02, the light shielding layer 12 can prevent lightfrom being incident on the edge of the first hollow part H of thedisplay layer 120, thereby avoiding the interference phenomenonoccurring to light incident on the edge of the first hollow part H ofthe display layer 120.

Typically, the OLED substrate is provided with a plurality of wirings,such as gate lines 90, data lines 100, control lines, and the like.Since the wirings on the OLED substrate are very dense, it is easy tocause an optical interference phenomenon, which in turn directly affectsthe clarity of imaging. In an embodiment of the present disclosure,since the substrate 110 comprises the light shielding layer 12 disposedon the base substrate 10, and the light shielding layer 12 can shieldlight to prevent light from being incident on the wirings, the opticalinterference phenomenon resulting from the dense wirings can be avoided.In case the OLED substrate is applied to an OLED transparent display,the definition of the OLED transparent display can be improved. Further,the light shielding layer 12 can also prevent light from being incidenton the active layer 201, thereby ensuring stable performance of the thinfilm transistor 20.

Here, when the substrate 110 comprises the base substrate 10, the etchbarrier layer 11 and the light shielding layer 12, the etch barrierlayer 11 may be disposed between the base substrate 10 and the lightshielding layer 12, or the light shielding layer 12 may be disposedbetween the etch barrier layer 11 and the base substrate 10. When theorthographic projection of the second hollow part on the base substrate10 is located within that of the first hollow part on the base substrate10, in order to prevent the portion of the light shielding layer 12 thatis exposed by the first hollow part H from being etched during theetching process for forming the display layer 120, optionally, as shownin FIG. 9, the light shielding layer 12 may be disposed between the etchbarrier layer 11 and the base substrate 10.

An embodiment of the present disclosure further provides an OLEDsubstrate comprising, as shown in FIG. 10, a light emitting region 01and a transparent region 02. The OLED substrate comprises a substrate110 and wirings 140 on the substrate 110. The substrate 110 comprises abase substrate 10 and a light shielding layer 12 on the base substrate10, wherein a portion of the light shielding layer 12 located in thetransparent region 02 has a second hollow part H′.

Here, the type of the wirings 140 on the OLED substrate is not limited,and they may be the gate lines 90, the data lines 100, the controllines, and the like.

The material of the light shielding layer 12 is not limited, as long asit is capable of shielding light. For example, the material of the lightshielding layer 12 may be a black resin or a metal, etc. Since the thinfilm transistor 20 and the light emitting device disposed on the OLEDsubstrate need to be subjected to high-temperature treatment during themanufacturing process, and the metal is high temperature-resistant, thematerial of the light shielding layer 12 in embodiments of the presentdisclosure can be selected as a metal material.

Since the wirings on the OLED substrate are very dense, it is easy tocause an optical interference phenomenon, which in turn directly affectsthe clarity of imaging. In an embodiment of the present disclosure,since the OLED substrate comprises the substrate 110 and the wirings 140disposed on the substrate 110, and the substrate 110 comprises the lightshielding layer 12 disposed on the base substrate 10, the lightshielding layer 12 can shield light to prevent light from being incidenton the wirings 140, so that the optical interference phenomenonresulting from the dense wirings 140 can be avoided. In case the aboveOLED substrate is applied to an OLED transparent display, the definitionof the OLED transparent display can be improved.

In an exemplary embodiment, as shown in FIG. 11 (the wirings 140 are notillustrated in FIG. 11), the OLED substrate comprises a display layer120 disposed on the substrate 110, and a portion of the display layer120 located in the transparent region 02 has a first hollow part H.

Specifically, as shown in FIG. 11, the display layer 120 may include,but is not limited to, a thin film transistor 20, a light emittingdevice, and a pixel defining layer 70. The thin film transistor 20comprises an active layer 201, a gate insulating layer 202, a gate 203,an interlayer dielectric layer 206, a first terminal 205, and a secondterminal 204. The second terminal 204 and the first terminal 205 areboth connected to the active layer. The pixel defining layer 70 has aplurality of openings such that the light emitting device is disposed ina respective one of the openings. The light emitting device comprises ananode 40, a cathode 60, and a light emitting functional layer 50sandwiched between the anode 40 and the cathode 60. The second terminal204 of the thin film transistor 20 is electrically connected to theanode 40 of the light emitting device, thereby driving the lightemitting device to emit light. The light emitting functional layer 50 ofthe light emitting device comprises a light emitting layer, andoptionally, at least one of an electron transport layer, an electroninjection layer, a hole transport layer, and a hole injection layer.

Further, as shown in FIG. 11, the display layer 120 may further comprisea planarization layer 30 disposed between the thin film transistor 20and the light emitting device to provide a flat support surface for thelight emitting device, ensuring uniformity of light emitted from thelight emitting device.

Further, as shown in FIG. 11, the display layer 120 may further comprisea buffer layer 130 disposed on the substrate 110, and the thin filmtransistor 20 and the light emitting device are disposed on the bufferlayer 130. The buffer layer 130 can play the role of adjusting stresses,neutralizing charges, and the like.

Upon implementation, the wirings 140 may be formed simultaneously withone or more layers of the display layer 120.

In the above-described OLED substrate provided by an embodiment of thepresent disclosure, since the portion of the display layer 120 locatedin the transparent region 02 has the first hollow part H, loss of lightcaused by the display layer 120 when the light passes through the firsthollow part is avoided, so that the transmittance of light when thelight passes through the transparent region 02 of the OLED substrate canbe enhanced. In case the above-described OLED substrate is applied to anOLED transparent display, the light transmittance of the transparentdisplay is enhanced, which increases the brightness of an image acquiredthrough the transparent region, thereby improving the user experience.

In an exemplary embodiment, the orthographic projection of the firsthollow part H on the base substrate 10 at least partially overlaps thatof the second hollow part H′ on the base substrate 10. For example, theorthographic projection of the second hollow part H′ on the basesubstrate 10 coincides with that of the first hollow part H on the basesubstrate 10. Alternatively, the orthographic projection of the secondhollow part H′ on the base substrate 10 is located within that of thefirst hollow part H on the base substrate 10. Alternatively, theorthographic projection of the first hollow part H on the base substrate10 is located within that of the second hollow part H′ on the basesubstrate 10.

Inventors of the present disclosure have found that, when images arebeing acquired through the transparent region 02, an interferencephenomenon occurs when light is incident on the edge of the first hollowpart H of the display layer 120, so that bright spots will appear in theimages acquired through the transparent region 02. Therefore,advantageously, as shown in FIG. 9, it is possible to make theorthographic projection of the second hollow part H′ on the basesubstrate 10 located within that of the first hollow part H on the basesubstrate 10. In this way, when images are being acquired through thetransparent region 02, the light shielding layer 12 can prevent lightfrom being incident on the edge of the first hollow part of the displaylayer 120, thereby avoiding the interference phenomenon occurring tolight incident on the edge of the first hollow part of the display layer120.

Optionally, as shown in FIG. 9, the substrate 110 further comprises atransparent etch barrier layer 11 disposed between the base substrate 10and the display layer 120.

Specifically, the etch barrier layer 11 may be disposed between the basesubstrate 10 and the light shielding layer 12, or the light shieldinglayer 12 may be disposed between the etch barrier layer 11 and the basesubstrate 10. When the orthographic projection of the second hollow parton the base substrate 10 is located within that of the first hollow parton the base substrate 10, in order to prevent the portion of the lightshielding layer 12 that is exposed by the first hollow part from beingetched during the etching process for forming the display layer 120,optionally, as shown in FIG. 9, the light shielding layer 12 may bedisposed between the etch barrier layer 11 and the base substrate 10.

Here, the material of the etch barrier layer 11 is not limited as longas it is capable of blocking etching during the etching process. In anexemplary embodiment, when the material of the light shielding layer 12is a metal material, induced charges are easily generated on the lightshielding layer 12, and the induced charges may cause the voltage of thethin film transistor 20 to be unstable. Therefore, in the case where thematerial of the light shielding layer 12 is a metal material and thesubstrate 110 comprises the etch barrier layer 11, optionally, thematerial of the etch barrier layer 11 may be a transparent conductivematerial. Since the etch barrier layer 11 has electrical conductivity,it is possible to connect the etch barrier layer 11 to the wirings andapply a fixed voltage to the wirings, to ensure that the light shieldinglayer 12 and the etch barrier layer 11 have stable voltages, therebyavoiding the problem that the light shielding layer 12 and the etchbarrier layer 11 cause the voltage of the thin film transistor 20 to beunstable. On this basis, when the material of the etch barrier layer 11is a transparent conductive material, the material of the etch barrierlayer 11 may be selected from at least one of ITO or IZO.

In the above embodiment of the present disclosure, since the substrate110 comprises the etch barrier layer 11, the etch barrier layer 11 canprevent etching from proceeding to the substrate 110 during the processof etching the display layer 120, so that the surface of the substrate110 remains flat and light scattering is avoided.

Further, an embodiment of the present disclosure provides a transparentdisplay comprising, as shown in FIGS. 13 and 14, any of the OLEDsubstrates described above and a package layer 80 for packaging the OLEDsubstrate.

The package layer 80 may be a substrate package layer as shown in FIG.13. Alternatively, the package layer 80 may also be a thin film packagelayer as shown in FIG. 14.

The transparent display may be any device that displays an imageregardless of being moving (e.g., video) or fixed (e.g., still image)and regardless of being textual or graphic. More specifically, it iscontemplated that the above-described embodiments can be implemented inor associated with a variety of electronic devices including, but notlimited to, a mobile phone, a wireless device, a personal data assistant(PDA), a handheld or portable computer, a GPS receiver/navigator, acamera, an MP4 video player, a camera, a game console, a watch, a clock,a calculator, a TV monitor, a tablet display, a computer monitor, anautomobile display (e.g., a mileage table display, etc.), a navigator, acockpit controller and/or display, a camera view display (e.g., adisplay of a rear view camera in a vehicle), an electronic photo, anelectronic billboard or signage, a projector, a building structure, apackaging and aesthetic structure (e.g., a display for an image of apiece of jewelry), and the like. In addition, the transparent displayprovided by the embodiment of the present disclosure may also be atransparent display panel.

An embodiment of the present disclosure provides a transparent display.When the portion of the display layer 120 of the OLED substrate in thetransparent display which is located in the transparent region 02 has afirst hollow part, since loss of light caused by the display layer 120when the light passes through the first hollow part is avoided, thelight transmittance of the transparent display is enhanced when lightpasses through the transparent region 02 of the transparent display,which increases the brightness of an image acquired through thetransparent region 02, thereby improving the user experience. Further,when the OLED substrate in the transparent display comprises thesubstrate 110 and the wirings 140 disposed on the substrate 110, thesubstrate 110 comprises the base substrate 10 and the light shieldinglayer 12 disposed on the base substrate 10, and the portion of the lightshielding layer 12 located in the transparent region 02 has a secondhollow part, such that the optical interference phenomenon caused by thedense wirings 140 is avoided because the light shielding layer 12 canshield light to prevent the light from being incident on the wirings140, thereby improving the definition of the OLED transparent display.

In the transparent display provided by the embodiment of the presentdisclosure, the base substrate 10 of the OLED substrate may be a rigidsubstrate or a flexible substrate. When the base substrate 10 is aflexible substrate, the base substrate 10 may be attached to a rigidsubstrate (such as a glass substrate), and then the display layer 120,the light shielding layer 12, or the etch barrier layer 11, etc. may beformed on the base substrate 10. After the transparent display has beenmanufactured, the base substrate 10 is peeled off the rigid substrate,thereby obtaining a flexible transparent display. In particular, thematerial of the flexible substrate may be, for example, polyimide.

What have been described above are merely specific embodiments of thepresent disclosure, but the scope of the present disclosure is notlimited so. Any variations or substitutions that can be readilyconceived by a skilled person familiar with this technical field withinthe technical scope revealed by the present disclosure shall beencompassed within the scope of the present disclosure. Thus, the scopeof the present disclosure shall be determined by the scope of theappended claims.

The invention claimed is:
 1. An OLED substrate comprising: a lightemitting region; and a transparent region, wherein the OLED substratecomprises a substrate and a display layer on the substrate, wherein_aportion of the display layer in the transparent region comprises a firsthollow part, wherein the substrate comprises a base substrate and alight shielding layer between the base substrate and the display layer,wherein a portion of the light shielding layer in the transparent regioncomprises a second hollow part, and wherein an orthographic projectionof the first hollow part on the base substrate at least partiallyoverlaps an orthographic projection of the second hollow part on thebase substrate.
 2. The OLED substrate according to claim 1, wherein thesubstrate comprises a base substrate and a transparent etch barrierlayer between the base substrate and the display layer.
 3. The OLEDsubstrate according to claim 1, wherein the orthographic projection ofthe first hollow part on the base substrate coincides with theorthographic projection of the second hollow part on the base substrate.4. The OLED substrate according to claim 3, wherein the orthographicprojection of the second hollow part on the base substrate is within theorthographic projection of the first hollow part on the base substrate.5. The OLED substrate according to claim 1, further comprising: atransparent etch barrier layer between the light shielding layer and thedisplay layer.
 6. The OLED substrate according to claim 5, wherein thelight shielding layer comprises a metal layer, and wherein thetransparent etch barrier layer comprises a transparent conductive layer.7. The OLED substrate according to claim 1, wherein the light shieldinglayer comprises one or more of a black resin layer or a metal layer. 8.The OLED substrate according to claim 1, wherein the display layercomprises a buffer layer, a thin film transistor, a planarization layer,a light emitting device, and a pixel defining layer in sequence on thesubstrate.
 9. The OLED substrate according to claim 1, wherein the OLEDsubstrate comprises a plurality of pixel units arranged in a matrix,wherein each pixel unit of the plurality of pixel units comprises atleast one sub-pixel unit, wherein each sub-pixel unit of the at leastone sub-pixel unit comprises a light emitting sub-region and atransparent sub-region, and wherein all light emitting sub-regionscomprise the light emitting region, and all transparent sub-regionscomprise the transparent region.
 10. The OLED substrate according toclaim 1, wherein the OLED substrate comprises a plurality of pixel unitsarranged in a matrix, wherein each pixel unit of the plurality of pixelunits comprises at least one sub-pixel unit, wherein all sub-pixel unitscomprise the light emitting region, and wherein regions among theplurality of pixel units comprise the transparent region.
 11. The OLEDsubstrate according to claim 1, further comprising: wirings on the lightshielding layer, wherein the wirings are formed of a same material in asame layer as at least one layer of the display layer.
 12. A transparentdisplay comprising the OLED substrate according to claim 1 and a packagelayer on the OLED substrate.
 13. The transparent display according toclaim 12, wherein the package layer comprises one of a substrate packagelayer or a thin film package layer.
 14. A method for manufacturing anOLED substrate, the OLED substrate comprising a light emitting regionand a transparent region, the method comprising: providing a substrate;forming a display layer on the substrate; and forming a first hollowpart in a portion of the display layer in the transparent region,wherein said providing a substrate comprises: providing a basesubstrate; forming a light shielding layer on the base substrate; andforming a second hollow part in a portion of the light shielding layerin the transparent region, wherein an orthographic projection of thefirst hollow part on the base substrate at least partially overlaps anorthographic projection of the second hollow part on the base substrate.15. The method according to claim 14, wherein the first hollow part isformed by an etching process, and wherein said providing a substratecomprises: providing a base substrate; and forming a transparent etchbarrier layer on the base substrate.
 16. The method according to claim14, wherein the orthographic projection of the second hollow part on thebase substrate is within the orthographic projection of the first hollowpart on the base substrate.
 17. The method according to claim 14,wherein said forming a display layer on the substrate comprises: forminga buffer layer, a thin film transistor, a planarization layer, a lightemitting device, and a pixel defining layer on the substratesuccessively.
 18. The method according to claim 14, further comprising:forming wirings on the light shielding layer, wherein the wirings areformed simultaneously with at least one layer of the display layer.